Importance

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Abstract

A multi-layer printed circuit board includes a core layer having a first circuit patterns formed on the upper and lower surface of a first insulation layer and via-holes in which a conductive layer is formed to electrically connect with the first circuit patterns. Built-up layers are formed on the upper and lower side of the core layer and have second circuit patterns electrically connected with the first circuit pattern by means of a via-holes in which conductive layers are formed to electrically connect the first circuit patterns of the core layer and the second circuit patterns of the upper and/or lower built-up layers. The via-holes in the core layer and the via-holes in the built-up layers are formed from an each side/both sides of the core layer and from the built-up layers toward the core layer, whereby interconnection of the circuit patterns is obtained without using through-holes and permitting shortening of the wiring and higher integration.

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First Claim