Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
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United States of America Patent
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Apr 22, 2003
Grant Date -
N/A
app pub date -
Dec 7, 2001
filing date -
Dec 7, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention pertains to apparatus and methods for maintaining wafer back side, bevel, and front side edge exclusion during supercritical fluid processing. Apparatus of the invention include a pedestal and an exclusion ring. When the exclusion ring is engaged with the pedestal a channel is formed. A reactant-free supercritical fluid is passed through the channel and over a circumferential front edge of a wafer. The flow of reactant-free supercritical fluid protects the bevel and circumferential front edge of the wafer from exposure to reactants in a supercritical processing medium. The back side of the wafer is protected by contact with the pedestal and the flow of reactant-free supercritical fluid. Exclusion rings of the invention, when engaged with their corresponding pedestals make no or very little physical contact with the wafer front side.
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