Substrate processing apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 22, 2003
Grant Date -
May 2, 2002
app pub date -
Oct 30, 2001
filing date -
Oct 30, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A removal liquid is supplied to a substrate on which a thin film formed is patterned by dry etching using a resist film as a mask, and cleaning is made with de-ionized water, thereby removing a reaction product generated on the surface of the substrate. After that, the processed substrate is heated, thereby completely drying the substrate from which the reaction product has been eliminated.
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