Polishing composition
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United States of America Patent
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-
Apr 22, 2003
Grant Date -
Mar 7, 2002
app pub date -
May 11, 2001
filing date -
May 12, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A polishing composition comprising an abrasive and water, wherein the abrasive has a particle size distribution such that (1) a ratio of D90 to D50 (D90/D50) is from 1.3 to 3.0, and (2) D50 is from 10 to 600 nm, wherein D90 is defined as a particle size at 90% counted from a smaller size side on a number base in a cumulative particle size distribution, and wherein D50 is defined as a particle size at 50% counted from a smaller size side on a number base in a cumulative particle size distribution.
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