In-mold label
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 22, 2003
Grant Date -
N/A
app pub date -
Apr 6, 1999
filing date -
Apr 6, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An in-mold label comprising a thermoplastic resin film base layer comprising a thermoplastic resin as the main component (I) carrying printed matter on its front side and a heat sealable resin layer (II) formed on the back side of the base layer (I) and made of a resin composition comprising 55-90 wt % of a polyethylene, 5-40 wt % of a polyetheresteramide, 1-20 wt % of a modified low-molecular weight polyethylene, and 0-20 wt % of a polyamide resin.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully