Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 22, 2003
Grant Date -
N/A
app pub date -
Aug 22, 2000
filing date -
Aug 22, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a semiconductor chip assembly includes providing a semiconductor chip that includes a conductive pad, and providing a support circuit that includes an insulative base, a conductive trace and a through-hole that extends through the conductive trace and is covered by the base. One embodiment includes disposing an adhesive beneath the through-hole, mechanically attaching the chip to the support circuit using the adhesive such that a portion of the pad is directly beneath the through-hole, and then applying an etch to form openings in the base and the adhesive such that the openings and the through-hole expose the pad. Another embodiment includes disposing an adhesive beneath the through-hole, applying an etch to form openings in the base and the adhesive, and then mechanically attaching the chip to the support circuit using the adhesive such that the openings and the through-hole expose the pad. Preferably, a connection joint is formed inside the through-hole that extends through the opening in the adhesive and electrically connects the conductive trace and the pad.
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