Method of injection molded flip chip encapsulation
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United States of America Patent
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Apr 22, 2003
Issued Date -
N/A
app pub date -
May 16, 2002
filing date -
Jun 27, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The electrical interconnections between an integrated circuit chip assembly are encapsulated and reinforced with a high viscosity encapsulant material in a single step molding process wherein a mold is placed over an integrated circuit chip assembly and encapsulant material is dispensed through an opening in the mold and forced around and under the integrated circuit chip by external pressure encapsulating the integrated circuit chip assembly. An integrated circuit chip assembly having a reinforced electrical connection which is more resistant to weakening as a result is stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.
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