Burst-ultrafast laser machining method
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United States of America Patent
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Apr 22, 2003
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app pub date -
Jan 25, 2001
filing date -
Jan 25, 2000
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Abstract
A method of laser processing or laser modification of materials. The combination of ultrafast laser pulses and high-repetition rate (>100 kHz) bursts (or continuous operation) defines a new and unexpected regime for material processing. The high repetition rate controls thermal and/or other relaxation processes evolving between each ultrafast laser pulse that `prepares` the sample surface or bulk to alter the interaction with subsequent ultrafast laser pulses and thereby improve or optimize the process, or enable a new process, that are not available at lower repetition rate. The addition of this laser-controlled thermal component, and/or the general control of relaxation processes, overcomes several current limitations of ultrafast laser processing at lower repetition rates (<100 kHz), providing means to further harness the many attributes of ultrafast lasers for general material processing and material modification applications.
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