Importance

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Abstract

A multiple die package is formed, which allows multiple die to be interconnected using internal leads or traces from a lead frame. A plurality of slots in the paddle area of the lead frame are created which define the internal signal traces. Then the outer portions of the die paddle area of the lead frame are removed or trimmed to isolate the internal traces from each other and form a plurality of individual internal leads. Multiple die, either stacked, in a planar array, or a combination of the two, are connected to selected internal leads, such as by wire bonding, to form the desired die-to-die interconnections for routing signals between die without interfering with normal wire bond fan-out. A tape can be adhered to the interior portion of the die paddle area prior to trimming to hold the internal traces in place and leave the ends of the traces exposed for wire bonding to the die. The internal traces also allow connections to be made within a single die by wire bonding selected bond pads from the die via one or more of the internal traces.

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First Claim