Molded plastic package with heat sink and enhanced electrical performance
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United States of America Patent
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Apr 22, 2003
Grant Date -
Jun 20, 2002
app pub date -
Jan 9, 2001
filing date -
Sep 3, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A molded plastic package for semiconductor devices incorporating a heat sink, controlled impedance leads and separate power and ground rings is described. The lead frame of the package, separated by a dielectric layer, is attached to a metal heat sink. It has more than one ring for power and ground connections. The die itself is attached directly onto the heat sink through a window on the dielectric and provides high power dissipation. The package is molded using conventional materials and equipment.
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