Method and apparatus for interim assembly electrical testing of circuit boards
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United States of America Patent
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-
Apr 22, 2003
Grant Date -
N/A
app pub date -
Dec 17, 2001
filing date -
Dec 17, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and a structure for assembling a circuit board whereby high temperature attach devices can be electrically tested prior to the joining of permanent low temperature attach devices. A test interposer, with low temperature attach known good reference devices, is placed in electrical contact with the circuit board containing high temperature attach devices. The test interposer/circuit board assembly can be used to identify any defective high temperature attach devices which can be replaced prior to joining the permanent low temperature attach devices on the circuit board. This partial interim test, when only the high temperature attach devices are mounted on the circuit board, eliminates the need to remove known good low temperature attach devices from the circuit board during the high temperature attach device rework process.
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