Radiator for electronic parts, electronic device, electric circuit device, and computer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 22, 2003
Grant Date -
May 2, 2002
app pub date -
Sep 11, 2001
filing date -
Sep 11, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
To prevent generation of air bubbles in thermal grease 37 when a wired board 24 is bent due to a difference of thermal expansibility between a CPU chip 31 and a heat sink 32 in a CPU package 21, the thermal grease 37 being filled between the CPU chip 31 and a plate member 34 of the heat sink 32. A through-hole 38 is formed almost in the center of a plate member 34 so as to go through the plate member 34.
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