Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 22, 2003
Grant Date -
N/A
app pub date -
Jun 28, 2000
filing date -
Jun 28, 2000
priority date (Note) -
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Abstract
A stacked-die assembly and a method of manufacturing a stacked-die assembly having a plurality of microelectronic devices. In one embodiment, a stacked-die assembly can include a first die, a second die juxtaposed to the first die, and an interface substrate coupled to the first and second dies. The first die can have a first integrated circuit and a first terminal array coupled to the first integrated circuit, and the second die can have a second integrated circuit and a second terminal array coupled to the second integrated circuit. The interface substrate can comprise a body, a first contact array on the body that is electrically coupled to the first terminal array of the first die, a second contact array on the body that is electrically coupled to the second terminal array of the second die, and at least one ball-pad array on the body. The interface substrate can also include interconnecting circuitry electrically coupling at least a portion of the first and second contact arrays with at least a portion of the first ball-pad array.
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