Sawing wire and method for the cutting and lapping of hard brittle workpieces

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United States of America Patent

PATENT NO 6554686
SERIAL NO

09593617

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Abstract

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A sawing wire is for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece. The sawing wire exhibits torsion. There is also a method for cutting and lapping using the sawing wire.

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Patent Owner(s)

Patent OwnerAddress
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AGJOHANNES-HESS-STRASSE 24 BURGHAUSEN 84489

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andrae, Christian Tussling, DE 3 183
Kaeser, Maximilian Burghausen, DE 3 6

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