Method and apparatus for bias deposition in a modulating electric field
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United States of America Patent
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Apr 29, 2003
Grant Date -
Feb 28, 2002
app pub date -
May 1, 2001
filing date -
Jun 5, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a method and apparatus for achieving conformal step coverage of one or more materials on a substrate using sputtered ionized material. In one embodiment, a chamber having one or more current return plates, a support member, an electromagnetic field generator and a support member is provided. The target provides a source of material to be sputtered by a plasma and then ionized by an inductive coil, thereby producing electrons and ions. During processing, a bias is applied to the support member by an RF power source. The return plates are selectively energized to provide a return path for the RF currents, thereby affecting the orientation of an electric field in the chamber.
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