Heating apparatus of hot-heat treatment device using semiconductor device
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United States of America Patent
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Apr 29, 2003
Grant Date -
N/A
app pub date -
Nov 28, 2000
filing date -
Dec 3, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heating apparatus of a hot-heat treatment device using a semiconductor device includes a heating element positioned in a heating cap for heating a transmission cover after being conducted when electric power is supplied thereto; a circuit board electrically connected with the heating element, for controlling a voltage and a temperature; and a fixing unit for integrally fixing the heating element within the heating cap. Since the light bulb in the heating structure of the heating cap for pressurizing and fomenting the diseased part of the body of the user as in the conventional art is replaced with a semiconductor device. Accordingly, its case is prevented from deforming and the lead wire is prevented from breaking due to heat, so that a high-quality product can be provided.
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