Method of making components with releasable leads
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United States of America Patent
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May 6, 2003
Issued Date -
N/A
app pub date -
Apr 14, 2000
filing date -
Feb 9, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.
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