ELECTRONIC COMPONENT PACKAGING STRIP
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United States of America Patent
Stats
-
May 6, 2003
Grant Date -
May 8, 2003
app pub date -
Nov 5, 2001
filing date -
Nov 5, 2001
priority date (Note) -
Granted
status (Latency Note)
Importance
Abstract
A packaging strip has a series of receiving cavities formed thereon for each receiving an electronic component therein. Each of the receiving cavities is internally provided along peripheral edges with ribs and near a central area with a stepped land portion. The electronic component is received in the receiving cavity with its peripheral edges rested on the ribs, so that most part of the electronic component is suspended in the receiving cavity and a distance is kept between contacts at a bottom surface of the electronic component and a bottom of the receiving cavity. The stepped land portion restricts the electronic component from moving in the receiving cavity. When the packaging strip is wound into a roll and compresses the receiving cavities, the land portions arch to elevate the electronic components, protecting contacts of the electronic components from damage due to collision with the receiving cavity.
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