Thermal capacity for electronic component operating in long pulses
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United States of America Patent
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-
May 6, 2003
Grant Date -
N/A
app pub date -
Jan 12, 2001
filing date -
May 21, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermal capacitor component which includes, on a substrate, a stack of different layers defined in the form of a mesa terminating at its upper part in an electrical contact layer, which layer is coated with an electrically and thermally conducting layer surmounted by a heat sink element in contact with the conducting layer. The heat sink element has a plane shape. In addition, the component has at least one pad including another stack of layers which is also coated with an electrically and thermally conducting layer. The heat sink element is also in contact with the conducting layer of this stack so as to conduct the heat from the heat sink element into the substrate. Such a thermal capacitor may find application in the cooling of semiconductor components.
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