Non-invasive process for circuit defect isolation using thermal expansion property of thermodynamics
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United States of America Patent
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May 6, 2003
Grant Date -
N/A
app pub date -
Nov 30, 1999
filing date -
Nov 30, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for detecting and locating a circuit defect. In a preferred embodiment, the apparatus includes a resistance measuring device for measuring the resistance of the circuit, a heat source, and a recorder. The heat source is placed near the surface of the circuit but is not placed in physical contact with the surface. The heat source is moved about to a plurality of points in a plane parallel to and above the surface of the circuit while the resistance of the circuit is measured when the heat source is at each of the points. The recorder is functionally connected to the resistance measuring device and to the heat source, and determines and records the horizontal location of the heat source and records the resistance of the circuit at each of these locations.
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