Resin transfer mold
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United States of America Patent
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May 13, 2003
Grant Date -
Feb 7, 2002
app pub date -
Oct 8, 2001
filing date -
Apr 9, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a seal pin indexed precisely in a resin transfer molding die to assure the desired resin-to-fiber ratio in the mold part, and, thereby, to produce reliably and consistently a part of minimum weight with adequate strength. The index/resin seal pin of the present invention for RTM mold dies is novel in that it provides the seal (via replaceable O-rings) on the threaded stem of the pin to prevent low viscosity resin from invading the threads, bolts pins, or other elements of the internal mandrel. The pin allows the entire inner mandrel to be enclosed and sealed within the mold cavity, simplifying the sealing system. The invention also relates to a method for using the seal pin in a resin transfer molding process.
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