Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 13, 2003
Grant Date -
N/A
app pub date -
Aug 22, 2000
filing date -
Aug 22, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The support circuit includes an insulative base, a conductive trace and a through-hole between its top and bottom surfaces. The through-hole includes a top sidewall portion adjacent to the top surface and a bottom sidewall portion adjacent to the bottom surface. The conductive trace includes a pillar at the top surface and a routing line at the bottom sidewall portion. An electrolessly plated contact terminal on the pillar extends above the base, and an electrolessly plated connection joint in the through-hole connects the routing line and the pad. Preferably, the connection joint is the only metal in the through-hole. A method of manufacturing the assembly includes simultaneously electrolessly plating the contact terminal and the connection joint.
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