Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 13, 2003
Grant Date -
Dec 13, 2001
app pub date -
Jul 11, 2001
filing date -
Feb 24, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Stiffeners for tapes, films, or other connective structures that are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated bonding processes. The stiffeners are fabricated by stereolithographic processes and may include one or two or more layers. The stiffeners are configured to prevent torsional flexion or bending of the connective structure to which they are to be secured. The stiffeners may reinforce sprocket or indexing holes in connective structures. The stiffeners may include apertures through which intermediate conductive elements or other structures secured to the connective structure may be exposed or protrude. The stereolithographic method for fabricating stiffeners may include use of a machine vision system that recognizes the position and orientation of one or more connective structures on which at least an element of each of the stiffeners is to be fabricated so that the application of material thereto may be controlled.
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