Method for stripping copper in damascene interconnects
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United States of America Patent
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May 20, 2003
Grant Date -
Aug 22, 2002
app pub date -
Apr 24, 2002
filing date -
Nov 22, 1999
priority date (Note) -
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Abstract
An inexpensive and safe copper removal method in the fabrication of integrated circuits is described. Copper is stripped or removed by a chemical mixture comprising an ammonium salt, an amine, and water. The rate of copper stripping can be controlled by varying the concentration of the ammonium salt component and the amount of water in the mixture. Also a novel chemical mixture for stripping copper and removing copper contamination is provided. The novel chemical mixture for removing or stripping copper comprises an ammonium salt, an amine, and water. For example, the novel chemical mixture may comprise ammonium fluoride, water, and ethylenediamine in a ratio of 1:1:1.
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