Resin composition and layered product
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United States of America Patent
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May 20, 2003
Grant Date -
N/A
app pub date -
Nov 9, 2001
filing date -
Nov 16, 1999
priority date (Note) -
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Abstract
A resin composition comprising a saponified ethylene-vinyl acetate copolymer (A), a polyamide resin having a melting point not exceeding 160.degree. C. (B), and a small proportion of a boron compound (C) and a laminate comprising a multi-lamellar shaped article comprised of the above resin composition layer (X) and a thermoplastic resin layer (Y).
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