Method of making electrical interconnection for attachment to a substrate
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United States of America Patent
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May 20, 2003
Grant Date -
Sep 6, 2001
app pub date -
Mar 26, 2001
filing date -
Dec 16, 1997
priority date (Note) -
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Abstract
The present invention is an electrical interconnection on a substrate and a method for forming an electrical interconnection on a substrate. The electrical interconnection in the present invention comprises a first metal layer, a first diffusion barrier layer on the first metal layer, a second metal layer on the first diffusion barrier layer, an organometallic layer on the second metal layer, and an electrical interconnect layer on the organometallic layer. The first diffusion barrier layer prevents diffusion of the first metal layer and the second metal layer therethrough. The organometallic layer is preferably formed by contacting the second metal layer with an organic material to form a organometallic layer. The organometallic layer chemically and physically protects the second metal layer, particularly by preventing the oxidation thereof.
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