US Patent No: 6,566,742

Number of patents in Portfolio can not be more than 2000

Structure for mounting components

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Importance

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Abstract

An acceleration sensor is disclosed which includes a capacitance-type acceleration detection element mounted on a ceramic base plate. The element comprises a movable electrode mounted between a pair of fixed electrodes. Acceleration of the sensor in a measurement direction causes the movable electrode to move relative to the fixed electrodes and the element has opposite ends in a direction perpendicular to the measurement direction. The acceleration detection element is mounted on the base at a first one of the opposite ends. Accordingly, the mounting surface of the acceleration sensor is parallel to the direction of acceleration to be detected. Thus the acceleration sensor can be surface-mounted on a printed board, and more be easily mounted in an automobile air bag control system or the like.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI, LTD.TOKYO32320

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsumoto, Masahiro Hitachi, JP 153 963
Miki, Masayuki Kanagawa, JP 47 695
Suzuki, Seikou Hitachiota, JP 26 414

Cited Art

Patent Info (Count) # Cites Year
 
ATSUGI UNISIA CORPORATION (1)
5,548,999 Mounting arrangement for acceleration detector element 11 1992
 
BREED TECHNOLOGIES, INC PATENT DEPARTMENT (1)
5,535,626 Sensor having direct-mounted sensing element 17 1994
 
CANON KABUSHIKI KAISHA (1)
5,285,097 Semiconductor sensor of electrostatic capacitance type 54 1992
 
COPAL COMPANY LIMITED (1)
5,253,526 Capacitive acceleration sensor with free diaphragm 19 1991
 
DELPHI TECHNOLOGIES, INC. (1)
5,233,871 Hybrid accelerometer assembly 32 1991
 
DENSO CORPORATION (1)
5,901,046 Surface mount type package unit and method for manufacturing the same 39 1997
 
DORF KETAL CHEMICALS, LLC (1)
5,288,768 Urea-modified isocyanurates 4 1992
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,241,133 Leadless pad array chip carrier 173 1992
 
FUJITSU LIMITED (1)
5,747,874 Semiconductor device, base member for semiconductor device and semiconductor device unit 22 1995
 
HITACHI AUTOMOTIVE ENGINEERING CO., INC. (1)
5,417,312 Semiconductor acceleration sensor and vehicle control system using the same 84 1993
 
HITACHI, LTD. (1)
5,095,752 Capacitance type accelerometer 86 1989
 
IMO INDUSTRIES INC. (1)
4,312,006 Methods and apparatus for recording information supplying wound materials and retaining tubular objects 3 1978
 
IWAKI ELECTRONICS CO., LTD. (1)
5,394,011 Package structure for semiconductor devices and method of manufacturing the same 25 1993
 
KYOCERA CORPORATION (1)
5,898,218 Structure for mounting electronic components and method for mounting the same 31 1997
 
LITTON SYSTEMS, INC. (1)
4,679,434 Integrated force balanced accelerometer 125 1985
 
MEASUREMENT SPECIALTIES, INC. (1)
5,503,016 Vertically mounted accelerometer chip 24 1994
 
NIPPONDENSO CO., LTD. (1)
5,554,806 Physical-quantity detecting device 27 1995
 
SENSATA TECHNOLOGIES, INC. (1)
5,239,871 Capacitive accelerometer 18 1990
 
WILLIAMS ADVANCED MATERIALS, INC. (1)
4,835,067 Corrosion resistant electroplating process, and plated article 13 1988

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
DYTRAN INSTRUMENTS, INC. (1)
8,375,793 Accelerometer for high temperature applications 0 2011
 
OKI SEMICONDUCTOR CO., LTD. (1)
7,615,835 Package for semiconductor acceleration sensor 1 2006
 
VISHAY GENERAL SEMICONDUCTOR LLC (1)
8,421,214 Semiconductor device and method for manufacturing a semiconductor device 0 2007

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 20, 2014
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Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00