Die layout for SAW devices and associated methods
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United States of America Patent
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-
May 20, 2003
Grant Date -
Mar 14, 2002
app pub date -
Mar 30, 2001
filing date -
Mar 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A surface-acoustic-wave die includes a generally rectangular die that comprises a piezoelectric material, atop which is positioned a surface-acoustic-wave electrode pattern. The pattern has a generally rectangular footprint, and the footprint has a top edge that is positioned at an acute, nonzero angle to a top end of the die. A pair of generally rectangular electrode pads are both in electrical contact with the electrode pattern, each pad adjacent diametrically opposed corners of the die. The device addresses the inefficiency in the conventional die layout technique, and provides a method for reducing the width of the die for SAW coupled resonator filters resulting in a smaller package.
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