Judging method and processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6568847
APP PUB NO 20020027942A1
SERIAL NO

09916503

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is a method of judging whether a substrate is accurately placed at a predetermined position when placing the substrate at the predetermined position on a plate to perform heat treatment or cooling treatment therefor. The present invention has the step of measuring temperature of the plate at least from a first point of time to a second point of time during which the plate temperature changes, after placing the substrate at the plate, the step of calculating a temperature integrated area I determined by a range enclosed the measured temperature curve changing in time sequence and a set temperature of the plate, and the step of comparing the calculated temperature integrated area I with threshold values of a temperature integrated area set in advance.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishijima, Yuuichi Kumamoto, JP 13 31
Okamura, Kouji Kumamoto, JP 14 129

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