Curable resin compositions
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United States of America Patent
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May 27, 2003
Grant Date -
N/A
app pub date -
Sep 20, 2001
filing date -
Mar 23, 1999
priority date (Note) -
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Abstract
To provide curable resin compositions capable of exhibiting a low modulus, a high break strength, a high elongation and a satisfactory water-resistant adhesiveness to mortar. One of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, and (c) an epoxy group-substituted silane compound; and another of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, (c) an epoxy group-substituted silane compound, and (d) an epoxy resin.
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