Method and apparatus for injection molded flip chip encapsulation
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United States of America Patent
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May 27, 2003
Issued Date -
N/A
app pub date -
Apr 8, 2002
filing date -
Jun 27, 1997
priority date (Note) -
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Abstract
The electrical connections of an integrated circuit chip assembly comprised of an integrated circuit chip attached to a substrate are encapsulated and reinforced with a high viscosity encapsulant material by dispensing the encapsulant material through an opening in the substrate into the space between the integrated circuit chip and the substrate. An integrated circuit chin assembly having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.
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