Flip chip image sensor package fabrication method
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United States of America Patent
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Jun 3, 2003
Grant Date -
N/A
app pub date -
Mar 27, 2000
filing date -
Mar 27, 2000
priority date (Note) -
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Abstract
A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package.
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