Method of forming a package for electronic parts
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 3, 2003
Grant Date -
Apr 18, 2002
app pub date -
Jul 18, 2001
filing date -
Jul 21, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package for receiving electronic parts is formed with decreased stress and stress concentration to obtain a desired warp and flatness. In particular, according to a cutting protruding part process, a package is accommodated to have a recessed part formed on one face of a metal plate by pressing the face of the metal plate so that a corresponding protruding part is formed bulging from an opposing face of the metal plate. The protruding part is cut by a cutting tool and a bottom which has a cavity shape and is thinner in size than the metal plate is formed at the recessed part. The protruding part is again formed bulging from the metal plate and cut by the cutting tool. The cutting direction is differed in alternately facing directions so that the stress from cutting is almost cancelled.
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