US Patent No: 6,572,944

Number of patents in Portfolio can not be more than 2000

Structure for fabricating a special-purpose die using a polymerizable tape

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Importance

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Abstract

A structure for protecting a special-purpose area of an image sensor die or a micromachine die during singulation of the die from a wafer includes a protective layer that has a polymerized upper zone and an unpolymerized lower zone. At least part of the unpolymerized lower zone has an adhesive lower surface that is attached to a top surface of the wafer so that the protective layer overlies and protects the special-purpose area during either frontside or backside sawing. The unpolymerized lower zone is then entirely polymerized to make the adhesive lower surface nonadhesive to facilitate removal of the protective layer from the die.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AMKOR TECHNOLOGY, INC.CHANDLER, AZ734

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Glenn, Thomas P Gilbert, AZ 136 4964
Hollaway, Roy Dale Chandler, AZ 37 826
Webster, Steven Chandler, AZ 125 2422

Cited Art

Patent Info (Count) # Cites Year
 
ANALOG DEVICES, INC. (1)
5,362,681 Method for separating circuit dies from a wafer 92 1992
 
DENSO CORPORATION (1)
6,245,593 Semiconductor device with flat protective adhesive sheet and method of manufacturing the same 46 1999
 
FUJITSU SEMICONDUCTOR LIMITED (1)
5,981,361 Fabrication process of a semiconductor device including a dicing process of a semiconductor wafer 21 1997
 
LINTEC CORPORATION (1)
6,176,966 Method of die bonding electronic component and die bonding apparatus thereof 50 1998
 
SILVERBROOK RESEARCH PTY LTD (1)
6,425,971 Method of fabricating devices incorporating microelectromechanical systems using UV curable tapes 32 2000
 
SONY CORPORATION (1)
5,641,714 Method of manufacturing members 47 1996
 
TEXAS INSTRUMENTS INCORPORATED (1)
5,435,876 Grid array masking tape process 98 1993

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,727,163 Method for sawing wafer 3 2003
 
WIN SEMICONDUCTORS CORP. (1)
8,033,011 Method for mounting a thinned semiconductor wafer on a carrier substrate 0 2008

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 3, 2014
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Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
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