Retaining ring interconnect used for 3-D stacking
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United States of America Patent
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Jun 3, 2003
Grant Date -
Mar 20, 2003
app pub date -
Sep 20, 2001
filing date -
Sep 20, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A retaining ring interconnect. A retaining ring is formed on a perimeter of a pad on each of two adjoining surfaces of two PCB substrates. A conductive paste is applied between the pads on the two adjoining surfaces. The retaining rings are aligned and facing with each other. By performing a heat compression process, the retaining rings are connected to encompass the conductive paste. A eutectic bond is thus formed to bond the two PCB substrates.
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