US Patent No: 6,574,250

Number of patents in Portfolio can not be more than 2000

Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths

ALSO PUBLISHED AS: 20020003130
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Abstract

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A burst (50) of ultrashort laser pulses (52) is employed to sever a conductive link (22) in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality. The duration of the burst (50) is preferably in the range of 10 ns to 500 ns; and the pulse width of each laser pulse (52) within the burst (50) is generally shorter than 25 ps, preferably shorter than or equal to 10 ps, and most preferably about 10 ps to 100 fs or shorter. The burst (50) can be treated as a single 'pulse' by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a burst (50) of laser pulses (52) at each link (22). Conventional wavelengths or their harmonics can be employed.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ELECTRO SCIENTIFIC INDUSTRIES, INC.PORTLAND, OR431

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harris, Richard S Portland, OR 50 410
Sun, Yunlong Beaverton, OR 99 972
Swenson, Edward J Portland, OR 47 455

Cited Art Landscape

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JMAR TECHNOLOGY CO. (2)
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5,558,789 Method of applying a laser beam creating micro-scale surface structures prior to deposition of film for increased adhesion 39 1994
 
UNIVERSITY OF MARYLAND, BALTIMORE (1)
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5,848,080 Short pulsewidth high pulse repetition frequency laser 35 1997

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (45)
6,727,458 Energy-efficient, laser-based method and system for processing target material 70 2001
8,217,304 Methods and systems for thermal-based laser processing a multi-material device 1 2002
7,671,295 Processing a memory link with a set of at least two laser pulses 5 2002
6,947,454 Laser pulse picking employing controlled AOM loading 13 2003
7,723,642 Laser-based system for memory link processing with picosecond lasers 1 2003
7,139,294 Multi-output harmonic laser and methods employing same 1 2004
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7,126,746 Generating sets of tailored laser pulses 27 2004
7,616,669 High energy pulse suppression method 3 2004
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7,482,551 Processing a memory link with a set of at least two laser pulses 4 2005
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8,116,341 Multiple laser wavelength and pulse width process drilling 0 2007
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8,338,746 Method for processing a memory link with a set of at least two laser pulses 1 2010
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8,253,066 Laser-based method and system for removing one or more target link structures 0 2010
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IMRA AMERICA, INC. (10)
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APPLIED MATERIALS, INC. (8)
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Electron Scientific Industries, Inc. (2)
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LASERFACTURING INC. (2)
7,804,043 Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser 13 2005
7,528,342 Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser 13 2005
 
ELECTRO SCIENTIFIC INDUSTRIES, LTD. (1)
8,383,982 Methods and systems for semiconductor structure processing using multiple laser beam spots 0 2007
 
GSI LUMONICS CORPORATION (1)
7,382,389 Methods and systems for thermal-based laser processing a multi-material device 8 2006
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
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NEC CORPORATION (1)
6,879,605 Method and apparatus for performing pattern defect repair using Q-switched mode-locked pulse laser 23 2001
 
Other [Check patent profile for assignment information] (1)
7,173,212 Method and apparatus for laser cutting and drilling of semiconductor materials and glass 8 2005

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