US Patent No: 6,574,250

Number of patents in Portfolio can not be more than 2000

Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths

1 Status Updates

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A burst (50) of ultrashort laser pulses (52) is employed to sever a conductive link (22) in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality. The duration of the burst (50) is preferably in the range of 10 ns to 500 ns; and the pulse width of each laser pulse (52) within the burst (50) is generally shorter than 25 ps, preferably shorter than or equal to 10 ps, and most preferably about 10 ps to 100 fs or shorter. The burst (50) can be treated as a single 'pulse' by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a burst (50) of laser pulses (52) at each link (22). Conventional wavelengths or their harmonics can be employed.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
ELECTRO SCIENTIFIC INDUSTRIES, INC.PORTLAND, OR389

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harris, Richard S Portland, OR 39 583
Sun, Yunlong Beaverton, OR 71 1435
Swenson, Edward J Portland, OR 36 652

Cited Art Landscape

Patent Info (Count) # Cites Year
 
GENERAL ELECTRIC COMPANY (1)
5,953,354 Laser resonator optical alignment 30 1998
 
Other [Check patent profile for assignment information] (2)
5,848,080 Short pulsewidth high pulse repetition frequency laser 35 1997
5,987,049 Mode locked solid-state laser pumped by a non-diffraction-limited pumping source and method for generating pulsed laser radiation by pumping with a non-diffraction-limited pumping beam 39 1998
 
THE REGENTS OF THE UNIVERSITY OF MICHIGAN (1)
5,656,186 Method for controlling configuration of laser induced breakdown and ablation 300 1994
 
SCIENCE & TECHNOLOGY DEVELOPMENT CORPORATION @ UNM (1)
5,175,664 Discharge of lightning with ultrashort laser pulses 40 1991
 
New Wave Research (1)
5,811,751 Multi-wavelength laser system, probe station and laser cutter system using the same 139 1997
 
PANASONIC CORPORATION OF NORTH AMERICA (1)
5,786,560 3-dimensional micromachining with femtosecond laser pulses 126 1997
 
CORNELL UNIVERSITY (1)
5,034,951 Femtosecond ultraviolet laser using ultra-thin beta barium borate 42 1990
 
The Research Foundation of City College of New York (1)
4,932,031 Chromium-doped foresterite laser system 34 1989
 
SPECTRA-PHYSICS LASERS, INC. (1)
4,646,308 Synchronously pumped dye laser using ultrashort pump pulses 39 1985
 
Tamar Technology Co. (2)
5,539,764 Laser generated X-ray source 36 1995
5,742,634 Picosecond laser 55 1996
 
Deutsche Forschungsanstalt fuer Luft- und Raumfahrt e. V. (1)
5,725,914 Process and apparatus for producing a functional structure of a semiconductor component 39 1995
 
HITACHI, LTD. (1)
5,208,437 Method of cutting interconnection pattern with laser and apparatus thereof 62 1991
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
5,513,194 Stretched-pulse fiber laser 103 1995
 
UNIVERSITY OF MARYLAND, BALTIMORE (1)
5,956,354 Dual media laser with mode locking 34 1996
 
NEC CORPORATION (1)
5,586,138 Multiple-cavity semiconductor laser capable of generating ultrashort light pulse train with ultrahigh repetition rate 31 1995
 
AT&T Bell Laboratories (1)
5,042,040 Amplitude noise reduction for optically pumped modelocked lasers 19 1990
 
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (1)
* 5,720,894 Ultrashort pulse high repetition rate laser system for biological tissue processing 172 1996
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (7)
5,265,114 System and method for selectively laser processing a target structure of one or more materials of a multimaterial, multilayer device 75 1992
5,473,624 Laser system and method for selectively severing links 45 1994
5,751,585 High speed, high accuracy multi-stage tool positioning system 110 1996
5,998,759 Laser processing 89 1996
6,025,256 Laser based method and system for integrated circuit repair or reconfiguration 43 1997
6,057,180 Method of severing electrically conductive links with ultraviolet laser output 137 1998
6,281,471 Energy-efficient, laser-based method and system for processing target material 161 1999
 
IMRA AMERICA, INC. (1)
5,627,848 Apparatus for producing femtosecond and picosecond pulses from modelocked fiber lasers cladding pumped with broad area diode laser arrays 127 1995
 
MRF, INC. (1)
5,520,679 Ophthalmic surgery method using non-contact scanning laser 189 1994
 
UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. (1)
5,558,789 Method of applying a laser beam creating micro-scale surface structures prior to deposition of film for increased adhesion 41 1994
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (12)
* 7,173,212 Method and apparatus for laser cutting and drilling of semiconductor materials and glass 12 2005
* 2006/0134,838 Processing a memory link with a set of at least two laser pulses 0 2005
* 2006/0131,288 Processing a memory link with a set of at least two laser pulses 24 2005
* 2006/0140,230 Processing a memory link with a set of at least two laser pulses 2 2006
* 2006/0141,680 Processing a memory link with a set of at least two laser pulses 0 2006
* 2006/0138,106 Processing a memory link with a set of at least two laser pulses 1 2006
* 2006/0138,107 Processing a memory link with a set of at least two laser pulses 1 2006
* 2006/0138,108 Processing a memory link with a set of at least two laser pulses 1 2006
* 2006/0138,110 Processing a memory link with a set of at least two laser pulses 0 2006
* 2006/0141,681 Processing a memory link with a set of at least two laser pulses 2 2006
* 2006/0138,109 Processing a memory link with a set of at least two laser pulses 0 2006
* 2010/0140,235 LASER SYSTEM FOR PROCESSING A MEMORY LINK WITH A SET OF AT LEAST TWO LASER PULSES 1 2010
 
MEERE COMPANY, INC. (1)
* 2010/0009,550 METHOD AND APPARATUS FOR MODIFYING INTEGRATED CIRCUIT BY LASER 5 2007
 
ELECTRO SCIENTIFIC INDUSTRIES, LTD. (2)
8,383,982 Methods and systems for semiconductor structure processing using multiple laser beam spots 1 2007
* 2008/0121,627 Methods and systems for semiconductor structure processing using multiple laser beam spots 1 2007
 
FUJIFILM CORPORATION (1)
* 2010/0271,928 ULTRASHORT PULSE LIGHT SOURCE AND TWO-PHOTON ABSORPTION RECORDING MEDIUM RECORDING APPARATUS HAVING THE SAME 1 2010
 
DISCO CORPORATION (1)
* 2006/0009,008 Method for the laser processing of a wafer 12 2005
 
TRACKINSIDE, SOCIETE ANONYME (1)
* 2008/0304,525 Method for Internal Laser Marking in Transparent Materials and Device for Implementing Said Method 2 2006
 
COHERENT, INC. (12)
8,135,050 Automated polarization correction 1 2006
* 8,173,929 Methods and systems for trimming circuits 0 2006
8,232,687 Intelligent laser interlock system 1 2007
8,189,971 Dispersion compensation in a chirped pulse amplification system 2 2008
8,125,704 Systems and methods for controlling a pulsed laser by combining laser signals 9 2008
8,139,910 Systems and methods for control of ultra short pulse amplification 1 2008
8,150,271 Active tuning of temporal dispersion in an ultrashort pulse laser system 0 2010
8,398,622 Portable optical ablation system 0 2010
8,884,184 Polymer tubing laser micromachining 0 2011
9,114,482 Laser based processing of layered materials 0 2011
8,921,733 Methods and systems for trimming circuits 0 2012
9,281,653 Intelligent laser interlock system 0 2012
 
GSI LUMONICS CORPORATION (3)
* 2006/0192,845 Methods and systems for thermal-based laser processing a multi-material device 4 2006
7,382,389 Methods and systems for thermal-based laser processing a multi-material device 8 2006
* 2007/0052,791 Methods and systems for thermal-based laser processing a multi-material device 1 2006
 
EWAG AG (1)
* 8,916,798 Laser machining apparatus with switchable laser system and laser machining method 0 2012
 
GSI GROUP CORPORATION (1)
* 2007/0215,575 Method and system for high-speed, precise, laser-based modification of one or more electrical elements 12 2007
 
NEC CORPORATION (2)
* 6,879,605 Method and apparatus for performing pattern defect repair using Q-switched mode-locked pulse laser 24 2001
* 2002/0009,843 Method for repairing pattern by laser andlaser-based pattern repair apparatus 1 2001
 
Tap Development Limited Liability Company (1)
* 2009/0004,368 Systems and methods for curing a deposited layer on a substrate 0 2007
 
GENTEX CORPORATION (1)
8,842,358 Apparatus, method, and process with laser induced channel edge 0 2013
 
Electron Scientific Industries, Inc. (2)
7,435,927 Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset 8 2005
8,809,734 Methods and systems for thermal-based laser processing a multi-material device 0 2012
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (80)
6,727,458 Energy-efficient, laser-based method and system for processing target material 78 2001
* 8,217,304 Methods and systems for thermal-based laser processing a multi-material device 1 2002
* 2002/0167,581 Methods and systems for thermal-based laser processing a multi-material device 98 2002
7,671,295 Processing a memory link with a set of at least two laser pulses 5 2002
* 2003/0222,324 Laser systems for passivation or link processing with a set of laser pulses 21 2003
6,947,454 Laser pulse picking employing controlled AOM loading 14 2003
7,723,642 Laser-based system for memory link processing with picosecond lasers 2 2003
* 2004/0134,896 Laser-based method and system for memory link processing with picosecond lasers 55 2003
* 2004/0188,399 Energy-efficient, laser-based method and system for processing target material 43 2004
7,139,294 Multi-output harmonic laser and methods employing same 1 2004
* 2005/0254,530 Multi-output harmonic laser and methods employing same 0 2004
* 7,348,516 Methods of and laser systems for link processing using laser pulses with specially tailored power profiles 25 2004
7,126,746 Generating sets of tailored laser pulses 30 2004
* 2005/0067,388 Methods of and laser systems for link processing using laser pulses with specially tailored power profiles 15 2004
* 2005/0041,976 Generating sets of tailored laser pulses 7 2004
7,616,669 High energy pulse suppression method 6 2004
* 2005/0100,062 High energy pulse suppression method 9 2004
* 2006/0114,948 Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams 2 2004
* 2005/0224,469 Efficient micro-machining apparatus and method employing multiple laser beams 8 2004
8,148,211 Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously 3 2005
7,935,941 Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures 5 2005
7,923,306 Semiconductor structure processing using multiple laser beam spots 1 2005
7,687,740 Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows 78 2005
7,633,034 Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure 5 2005
7,629,234 Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling 17 2005
7,425,471 Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset 11 2005
* 2005/0282,406 Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows 9 2005
* 2005/0279,739 Semiconductor structure processing using multiple laser beam spots spaced on-axis to increase single-blow throughput 21 2005
* 2005/0281,101 Semiconductor structure processing using multiple laterally spaced laser beam spots with on-axis offset 1 2005
* 2005/0282,367 Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures 8 2005
7,396,706 Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks 6 2005
7,301,981 Methods for synchronized pulse shape tailoring 7 2005
7,289,549 Lasers for synchronized pulse shape tailoring 4 2005
* 2006/0128,073 Multiple-wavelength laser micromachining of semiconductor devices 6 2005
* 2006/0126,678 Methods for synchronized pulse shape tailoring 5 2005
* 2006/0126,677 Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks 1 2005
* 2006/0126,674 Lasers for synchronized pulse shape tailoring 1 2005
* 8,193,468 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure 1 2005
* 2006/0028,655 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure 30 2005
7,482,551 Processing a memory link with a set of at least two laser pulses 5 2005
7,582,848 Energy-efficient, laser-based method and system for processing target material 5 2005
* 2006/0086,702 Energy-efficient, laser-based method and system for processing target material 21 2005
7,394,476 Methods and systems for thermal-based laser processing a multi-material device 17 2006
7,605,343 Micromachining with short-pulsed, solid-state UV laser 7 2006
8,084,706 System and method for laser processing at non-constant velocities 3 2006
* 2008/0029,491 SYSTEM AND METHOD FOR LASER PROCESSING AT NON-CONSTANT VELOCITIES 6 2006
7,469,831 Laser-based method and system for processing targeted surface material and article produced thereby 6 2006
* 7,955,905 Methods and systems for thermal-based laser processing a multi-material device 2 2006
* 2007/0215,820 Methods and systems for thermal-based laser processing a multi-material device 25 2006
* 2008/0094,640 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structure 32 2006
7,563,695 Method and system for high-speed precise laser trimming and scan lens for use therein 4 2007
7,838,794 Laser-based method and system for removing one or more target link structures 0 2007
* 2007/0199,927 Laser-based method and system for removing one or more target link structures 24 2007
8,116,341 Multiple laser wavelength and pulse width process drilling 0 2007
* 2008/0296,272 MULTIPLE LASER WAVELENGTH AND PULSE WIDTH PROCESS DRILLING 5 2007
7,750,268 Energy efficient, laser-based method and system for processing target material 4 2007
* 2009/0141,750 SYSTEMS AND METHODS FOR LINK PROCESSING WITH ULTRAFAST AND NANOSECOND LASER PULSES 2 2007
7,679,030 Energy-efficient, laser-based method and system for processing target material 4 2008
* 2008/0105,664 ENERGY-EFFICIENT, LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGET MATERIAL 8 2008
8,526,473 Methods and systems for dynamically generating tailored laser pulses 2 2008
7,982,160 Photonic clock stabilized laser comb processing 4 2008
* 2009/0245,302 METHODS AND SYSTEMS FOR DYNAMICALLY GENERATING TAILORED LASER PULSES 26 2008
* 2009/0242,531 PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING 8 2008
7,955,906 Methods and systems for thermal-based laser processing a multi-material device 4 2008
8,178,818 Photonic milling using dynamic beam arrays 3 2008
* 2009/0242,522 PHOTONIC MILLING USING DYNAMIC BEAM ARRAYS 8 2008
8,309,885 Pulse temporal programmable ultrafast burst mode laser for micromachining 1 2009
* 2010/0177,794 PULSE TEMPORAL PROGRAMMABLE ULTRAFAST BURST MODE LASER FOR MICROMACHINING 8 2009
* 2010/0246,611 LASER MICROMACHINING WITH TAILORED BURSTS OF SHORT LASER PULSES 15 2009
8,415,586 Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses 0 2009
8,081,668 High energy pulse suppression method 2 2009
* 2010/0046,561 HIGH ENERGY PULSE SUPPRESSION METHOD 3 2009
7,871,903 Method and system for high-speed, precise micromachining an array of devices 4 2009
8,338,746 Method for processing a memory link with a set of at least two laser pulses 9 2010
8,476,552 Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes 0 2010
* 2010/0276,405 LASER SYSTEMS AND METHODS USING TRIANGULAR-SHAPED TAILORED LASER PULSES FOR SELECTED TARGET CLASSES 9 2010
8,253,066 Laser-based method and system for removing one or more target link structures 3 2010
8,598,490 Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes 1 2011
8,358,671 Photonic clock stabilized laser comb processing 0 2011
9,036,247 Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use 0 2013
 
UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION, INC. (1)
9,022,037 Laser ablation method and apparatus having a feedback loop and control unit 0 2005
 
Semiconductor Energy Laboratory Co., Ltd. (6)
7,551,655 Laser irradiation apparatus, laser irradiation method and method for manufacturing semiconductor device 21 2004
7,486,706 Laser irradiation apparatus, laser irradiation method and method for manufacturing semiconductor device 0 2004
* 2005/0115,930 Laser irradiation apparatus, laser irradiation method and method for manufacturing semiconductor device 41 2004
7,608,527 Laser irradiation method and method for manufacturing crystalline semiconductor film 4 2004
* 2005/0139,786 Laser irradiation method and method for manufacturing crystalline semiconductor film 22 2004
7,902,002 Semiconductor device 0 2005
 
APPLIED MATERIALS, INC. (74)
9,126,285 Laser and plasma etch wafer dicing using physically-removable mask 0 2011
9,129,904 Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch 0 2011
9,029,242 Damage isolation by shaped beam delivery in laser scribing process 0 2011
8,912,077 Hybrid laser and plasma etch wafer dicing using substrate carrier 1 2011
8,759,197 Multi-step and asymmetrically shaped laser beam scribing 1 2011
8,703,581 Water soluble mask for substrate dicing by laser and plasma etch 2 2011
8,642,448 Wafer dicing using femtosecond-based laser and plasma etch 8 2011
8,598,016 In-situ deposited mask layer for device singulation by laser scribing and plasma etch 1 2011
8,557,682 Multi-layer mask for substrate dicing by laser and plasma etch 2 2011
8,507,363 Laser and plasma etch wafer dicing using water-soluble die attach film 3 2011
8,951,819 Wafer dicing using hybrid split-beam laser scribing process with plasma etch 0 2011
8,557,683 Multi-step and asymmetrically shaped laser beam scribing 1 2011
8,946,057 Laser and plasma etch wafer dicing using UV-curable adhesive film 0 2013
8,652,940 Wafer dicing used hybrid multi-step laser scribing process with plasma etch 2 2013
9,048,309 Uniform masking for wafer dicing using laser and plasma etch 1 2013
8,969,177 Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film 0 2013
8,859,397 Method of coating water soluble mask for laser scribing and plasma etch 1 2013
8,940,619 Method of diced wafer transportation 0 2013
8,993,414 Laser scribing and plasma etch for high die break strength and clean sidewall 0 2013
8,845,854 Laser, plasma etch, and backside grind process for wafer dicing 2 2013
9,224,625 Laser and plasma etch wafer dicing using water-soluble die attach film 0 2013
8,883,614 Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach 4 2013
9,159,574 Method of silicon etch for trench sidewall smoothing 0 2013
9,054,176 Multi-step and asymmetrically shaped laser beam scribing 0 2013
9,252,057 Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application 0 2013
9,041,198 Maskless hybrid laser scribing and plasma etching wafer dicing process 0 2013
9,105,710 Wafer dicing method for improving die packaging quality 0 2013
8,975,162 Wafer dicing from wafer backside 0 2013
9,312,177 Screen print mask for laser scribe and plasma etch wafer dicing process 0 2013
9,224,650 Wafer dicing from wafer backside and front side 0 2013
9,293,304 Plasma thermal shield for heat dissipation in plasma chamber 0 2013
8,853,056 Wafer dicing using femtosecond-based laser and plasma etch 3 2014
8,846,498 Wafer dicing using hybrid multi-step laser scribing process with plasma etch 1 2014
9,236,305 Wafer dicing with etch chamber shield ring for film frame wafer applications 0 2014
8,980,726 Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers 0 2014
9,218,992 Hybrid laser and plasma etch wafer dicing using substrate carrier 0 2014
9,299,611 Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance 0 2014
9,018,079 Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean 4 2014
9,012,305 Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean 4 2014
8,927,393 Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing 1 2014
9,236,284 Cooled tape frame lift and low contact shadow ring for plasma heat isolation 0 2014
8,991,329 Wafer coating 0 2014
9,263,308 Water soluble mask for substrate dicing by laser and plasma etch 0 2014
9,130,030 Baking tool for improved wafer coating process 0 2014
9,165,812 Cooled tape frame lift and low contact shadow ring for plasma heat isolation 0 2014
9,275,902 Dicing processes for thin wafers with bumps on wafer backside 0 2014
9,076,860 Residue removal from singulated die sidewall 0 2014
8,975,163 Laser-dominated laser scribing and plasma etch hybrid wafer dicing 0 2014
8,932,939 Water soluble mask formation by dry film lamination 0 2014
8,912,078 Dicing wafers having solder bumps on wafer backside 1 2014
8,999,816 Pre-patterned dry laminate mask for wafer dicing processes 0 2014
8,912,075 Wafer edge warp supression for thin wafer supported by tape frame 3 2014
9,159,621 Dicing tape protection for wafer dicing using laser scribe process 0 2014
8,980,727 Substrate patterning using hybrid laser scribing and plasma etching processing schemes 1 2014
9,112,050 Dicing tape thermal management by wafer frame support ring cooling during plasma dicing 0 2014
9,034,771 Cooling pedestal for dicing tape thermal management during plasma dicing 1 2014
9,165,832 Method of die singulation using laser ablation and induction of internal defects with a laser 1 2014
9,142,459 Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination 0 2014
9,130,057 Hybrid dicing process using a blade and laser 0 2014
9,093,518 Singulation of wafers having wafer-level underfill 0 2014
9,209,084 Maskless hybrid laser scribing and plasma etching wafer dicing process 0 2014
8,883,615 Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes 3 2014
9,196,498 Stationary actively-cooled shadow ring for heat dissipation in plasma chamber 0 2014
9,117,868 Bipolar electrostatic chuck for dicing tape thermal management during plasma dicing 0 2014
9,245,802 Wafer dicing using femtosecond-based laser and plasma etch 0 2014
9,177,864 Method of coating water soluble mask for laser scribing and plasma etch 0 2014
9,281,244 Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process 0 2014
9,177,861 Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile 0 2014
9,196,536 Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process 0 2014
9,130,056 Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing 0 2014
9,245,803 Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process 0 2014
9,299,614 Method and carrier for dicing a wafer 0 2014
9,269,604 Wafer edge warp suppression for thin wafer supported by tape frame 0 2014
9,159,624 Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach 0 2015
 
IMRA AMERICA, INC. (19)
* 7,491,909 Pulsed laser processing with controlled thermal and physical alterations 6 2004
7,486,705 Femtosecond laser processing system with process parameters, controls and feedback 14 2004
* 2005/0226,287 Femtosecond laser processing system with process parameters, controls and feedback 79 2004
* 2005/0218,122 Pulsed laser processing with controlled thermal and physical alterations 36 2004
7,440,162 High power fiber chirped pulse amplification system utilizing telecom-type components 3 2006
* 2007/0008,611 High power fiber chirped pulse amplification system utilizing telecom-type components 0 2006
7,567,376 High power fiber chirped pulse amplification system utilizing telecom-type components 0 2008
* 2009/0246,413 METHOD FOR FABRICATING THIN FILMS 7 2008
7,912,100 Femtosecond laser processing system with process parameters, controls and feedback 3 2008
* 2009/0097,514 FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS, CONTROLS AND FEEDBACK 1 2008
8,246,714 Production of metal and metal-alloy nanoparticles with high repetition rate ultrafast pulsed laser ablation in liquids 3 2009
* 2009/0246,530 Method For Fabricating Thin Films 7 2009
7,907,334 High power fiber chirped pulse amplification system utilizing telecom-type components 0 2009
8,858,676 Nanoparticle production in liquid with multiple-pulse ultrafast laser ablation 0 2010
8,540,173 Production of fine particles of functional ceramic by using pulsed laser 1 2010
8,279,903 Femtosecond laser processing system with process parameters, controls and feedback 3 2011
* 2011/0139,760 FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS CONTROLS AND FEEDBACK 4 2011
8,644,356 Femtosecond laser processing system with process parameters controls and feedback 4 2012
9,147,989 Femtosecond laser processing system with process parameters controls and feedback 0 2013
 
LASERFACTURING INC. (4)
* 7,804,043 Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser 61 2005
7,528,342 Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser 20 2005
* 2006/0169,677 Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser 39 2005
* 2009/0194,516 METHOD AND APPARATUS FOR VIA DRILLING AND SELECTIVE MATERIAL REMOVAL USING AN ULTRAFAST PULSE LASER 8 2009
 
VOLVO CAR CORPORATION (1)
* 2009/0039,060 Lasercutting With Scanner 1 2008
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 7,057,135 Method of precise laser nanomachining with UV ultrafast laser pulses 47 2004
* 2005/0194,365 Method of precise laser nanomachining with UV ultrafast laser pulses 12 2004
* Cited By Examiner