US Patent No: 6,574,250

Number of patents in Portfolio can not be more than 2000

Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths

ALSO PUBLISHED AS: 20020003130
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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A burst (50) of ultrashort laser pulses (52) is employed to sever a conductive link (22) in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality. The duration of the burst (50) is preferably in the range of 10 ns to 500 ns; and the pulse width of each laser pulse (52) within the burst (50) is generally shorter than 25 ps, preferably shorter than or equal to 10 ps, and most preferably about 10 ps to 100 fs or shorter. The burst (50) can be treated as a single 'pulse' by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a burst (50) of laser pulses (52) at each link (22). Conventional wavelengths or their harmonics can be employed.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ELECTRO SCIENTIFIC INDUSTRIES, INC.PORTLAND, OR387

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harris, Richard S Portland, OR 39 412
Sun, Yunlong Beaverton, OR 71 1071
Swenson, Edward J Portland, OR 36 506

Cited Art Landscape

Patent Info (Count) # Cites Year
 
GENERAL ELECTRIC COMPANY (1)
5,953,354 Laser resonator optical alignment 30 1998
 
Other [Check patent profile for assignment information] (1)
5,848,080 Short pulsewidth high pulse repetition frequency laser 35 1997
 
THE REGENTS OF THE UNIVERSITY OF MICHIGAN (1)
5,656,186 Method for controlling configuration of laser induced breakdown and ablation 268 1994
 
SCIENCE & TECHNOLOGY DEVELOPMENT CORPORATION @ UNM (1)
5,175,664 Discharge of lightning with ultrashort laser pulses 40 1991
 
New Wave Research (1)
5,811,751 Multi-wavelength laser system, probe station and laser cutter system using the same 139 1997
 
PANASONIC CORPORATION OF NORTH AMERICA (1)
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CORNELL UNIVERSITY (1)
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The Research Foundation of City College of New York (1)
4,932,031 Chromium-doped foresterite laser system 34 1989
 
SPECTRA-PHYSICS LASERS, INC. (1)
4,646,308 Synchronously pumped dye laser using ultrashort pump pulses 39 1985
 
JMAR TECHNOLOGY CO. (2)
5,539,764 Laser generated X-ray source 36 1995
5,742,634 Picosecond laser 55 1996
 
DLR, DEUTSCHE ZENTRUM FUR LUFT UND RAUMFAHRT E.V. (1)
5,725,914 Process and apparatus for producing a functional structure of a semiconductor component 39 1995
 
HITACHI, LTD. (1)
5,208,437 Method of cutting interconnection pattern with laser and apparatus thereof 62 1991
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
5,513,194 Stretched-pulse fiber laser 101 1995
 
UNIVERSITY OF MARYLAND, BALTIMORE (1)
5,956,354 Dual media laser with mode locking 34 1996
 
NEC CORPORATION (1)
5,586,138 Multiple-cavity semiconductor laser capable of generating ultrashort light pulse train with ultrahigh repetition rate 31 1995
 
AT&T Bell Laboratories (1)
5,042,040 Amplitude noise reduction for optically pumped modelocked lasers 19 1990
 
JDSU ULTRAFAST LASERS AG (1)
5,987,049 Mode locked solid-state laser pumped by a non-diffraction-limited pumping source and method for generating pulsed laser radiation by pumping with a non-diffraction-limited pumping beam 39 1998
 
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (1)
* 5,720,894 Ultrashort pulse high repetition rate laser system for biological tissue processing 151 1996
 
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5,473,624 Laser system and method for selectively severing links 45 1994
5,751,585 High speed, high accuracy multi-stage tool positioning system 109 1996
5,998,759 Laser processing 87 1996
6,025,256 Laser based method and system for integrated circuit repair or reconfiguration 43 1997
6,057,180 Method of severing electrically conductive links with ultraviolet laser output 102 1998
6,281,471 Energy-efficient, laser-based method and system for processing target material 150 1999
 
IMRA AMERICA, INC. (1)
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MRF, INC. (1)
5,520,679 Ophthalmic surgery method using non-contact scanning laser 169 1994
 
UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. (1)
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6,727,458 Energy-efficient, laser-based method and system for processing target material 76 2001
* 8,217,304 Methods and systems for thermal-based laser processing a multi-material device 1 2002
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7,723,642 Laser-based system for memory link processing with picosecond lasers 2 2003
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7,582,848 Energy-efficient, laser-based method and system for processing target material 4 2005
7,394,476 Methods and systems for thermal-based laser processing a multi-material device 17 2006
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* 7,955,905 Methods and systems for thermal-based laser processing a multi-material device 2 2006
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* 8,173,929 Methods and systems for trimming circuits 0 2006
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8,912,077 Hybrid laser and plasma etch wafer dicing using substrate carrier 0 2011
8,759,197 Multi-step and asymmetrically shaped laser beam scribing 1 2011
8,703,581 Water soluble mask for substrate dicing by laser and plasma etch 1 2011
8,642,448 Wafer dicing using femtosecond-based laser and plasma etch 4 2011
8,598,016 In-situ deposited mask layer for device singulation by laser scribing and plasma etch 1 2011
8,557,682 Multi-layer mask for substrate dicing by laser and plasma etch 1 2011
8,507,363 Laser and plasma etch wafer dicing using water-soluble die attach film 2 2011
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8,557,683 Multi-step and asymmetrically shaped laser beam scribing 1 2011
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* 7,804,043 Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser 29 2005
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* 7,491,909 Pulsed laser processing with controlled thermal and physical alterations 5 2004
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7,567,376 High power fiber chirped pulse amplification system utilizing telecom-type components 0 2008
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