System and method for solder ball rework
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United States of America Patent
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-
Jun 10, 2003
Grant Date -
N/A
app pub date -
Apr 11, 2001
filing date -
Apr 11, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system and method have been provided for removing high lead content solder balls from the surface of a circuit package for the purpose of rework. The invention is applicable to ball grid array (BGA), C4 balls, chip scale balls, and flip chip bumps. Advantageously, the room temperature solder ball rework procedure minimizes damage to the circuit package. Specifically, a thin-film stainless steel mask with openings to expose the solder balls, is formed over the circuit package, and the solder balls are removed in a shearing or grinding operation, leaving a solder ball residue. Then, a conventional thick mask film is formed and a solder paste is deposited to fill the apertures. The solder ball residue forms a wettable surface for the low temperature attachment of new solder balls.
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