Joining of different materials of carrier for fluid ejection devices
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United States of America Patent
Stats
-
Jun 10, 2003
Grant Date -
May 1, 2003
app pub date -
Oct 31, 2001
filing date -
Oct 31, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A carrier for a plurality of fluid ejection devices includes a substrate and a substructure. The substrate includes a first material and has a first side adapted to receive the fluid ejection devices and a second side opposite the first side, and the substructure is formed of a second material and joined to the second side of the substrate with a lap joint. The lap joint includes a first portion formed by a portion of one of the substrate and the substructure, a second portion formed by a portion of the other of the substrate and the substructure, and a third material interposed between the first portion and the second portion.
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