Method and apparatus for drilling microvia holes in electrical circuit interconnection packages

United States of America Patent

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Jun 10, 2003
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N/A
app pub date
Nov 27, 2000
filing date
May 27, 1998

priority date (Note)
Expired

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Abstract

This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.

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Patent Owner(s)

Patent Owner	Address
EXITECH LIMITED	OXFORD INDUSTRIAL PARK YARNTON OXFORD OX5 1QU
EXITECH LTD	MILTON KEYNES ENGLAND MILTON KEYNES BUKINGHAMSHIRE

International Classification(s)

B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Gower, Malcolm Charles	Oxford, GB	1	51
Rumsby, Philip Thomas	Bladon, GB	18	262
Thomas, Dafydd Wyn	Menlo Park, CA	1	51

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Method and apparatus for drilling microvia holes in electrical circuit interconnection packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

09724046

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PATENT NO	6576869
SERIAL NO	09724046
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09724046

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