Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die
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United States of America Patent
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-
Jun 10, 2003
Grant Date -
Nov 8, 2001
app pub date -
Jun 25, 2001
filing date -
Apr 7, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.
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