Packages formed by attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip
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United States of America Patent
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Jun 10, 2003
Grant Date -
May 23, 2002
app pub date -
Oct 19, 2001
filing date -
Jun 18, 1999
priority date (Note) -
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Abstract
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned adhesive layer on a portion of the active surface. A leadframe having leads with inner lead ends and outer lead ends is provided. The inner lead ends of the leads are aligned proximate to the adhesive-free area and the leads are attached to the adhesive layer on the active surface of the semiconductor chip. The outer lead ends are oriented to form a footprint which is not substantially larger than the dimensions of the semiconductor chip.
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