Thin semiconductor package with semiconductor chip and electronic discrete device
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United States of America Patent
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Jun 10, 2003
Grant Date -
N/A
app pub date -
Feb 28, 2002
filing date -
Feb 28, 2002
priority date (Note) -
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Abstract
Semiconductor packages including at least one semiconductor chip and at least one electronic discrete device, such as a transistor, oscillator, optical sensor, resistor, capacitor, or inductor, are disclosed. The semiconductor chip and the discrete device are electrically coupled to each other, and are encapsulated within a protective encapsulant material. The semiconductor chip and the discrete device are disposed either in an aperture through the substrate or in a pocket of the substrate, thereby allowing for a thin package, even where the discrete device is taller (e.g., 1.5 to 5 times taller) than the semiconductor chip and/or substrate.
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