US Patent No: 6,579,399
Number of patents in Portfolio can not be more than 2000
Method and system for handling semiconductor components
Stats
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Jun 17, 2003
Issued date -
Apr 26, 2000
filing date -
09/559,807
serial no -
Expired
status
Importance
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Abstract
A carrier for semiconductor components, and a method and system for handling semiconductor components using the carrier, are provided. The carrier includes a frame having component mounting sites that include adhesive members for retaining the components on the carrier. The adhesive members can include one or more pieces of polymer tape having low tack adhesive surfaces for retaining the components, and high tack adhesive surfaces for bonding to the carrier. The low tack adhesive surfaces are formulated to provide adhesive forces sufficient to retain the components on the component mounting sites, but low enough to allow a conventional pick and place vacuum tool to remove the components from the carrier. The adhesive forces on the components are determined by a contact area between the components and low tack adhesive surfaces, and by adhesive qualities of the low tack adhesive surfaces.
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First Claim
Related Publications
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International Classification(s)
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- [Patents Count]
Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,141,790 Repositionable pressure-sensitive adhesive tape | 157 | 1989 | |
| 5,389,438 Repositionable adhesive tape | 50 | 1991 | |
| 5,378,536 Repositionable adhesive tape | 32 | 1992 | |
| 5,629,063 Repositionable tape closure system for a thin film article | 30 | 1995 | |
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| 5,852,870 Method of making grid array assembly | 29 | 1996 | |
| 5,985,695 Method of making a molded flex circuit ball grid array | 71 | 1998 | |
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| 6,136,137 System and method for dicing semiconductor components | 31 | 1998 | |
| 6,319,354 System and method for dicing semiconductor components | 15 | 2000 | |
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| 6,235,387 Semiconductor wafer processing tapes | 16 | 1998 | |
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| 5,152,393 Microchip storage tape | 23 | 1991 | |
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| 5,476,566 Method for thinning a semiconductor wafer | 73 | 1994 | |
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| 5,769,237 Tape carrier for electronic and electrical parts | 16 | 1996 | |
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| 6,054,008 Process for adhesively attaching a temporary lid to a microelectronic package | 11 | 1998 | |
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| 5,576,936 Compact electronic data module with nonvolatile memory | 6 | 1995 | |
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| 5,727,310 Method of manufacturing a multilayer electronic circuit | 39 | 1996 | |
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| 5,534,102 Component supply method | 36 | 1994 | |
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| 5,620,928 Ultra thin ball grid array using a flex tape or printed wiring board substrate and method | 72 | 1995 | |
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| 5,089,314 Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series | 18 | 1990 | |
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| 6,357,594 Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes | 12 | 1998 | |
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| 5,622,900 Wafer-like processing after sawing DMDs | 35 | 1995 | |
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| 5,667,073 Carrier tape for storage use of electronic components | 15 | 1996 | |
| 5,696,032 Tape application platform and processes therefor | 19 | 1996 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 17, 2014 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |