Use of variable impedance to control coil sputter distribution
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United States of America Patent
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Jun 17, 2003
Grant Date -
N/A
app pub date -
May 16, 1997
filing date -
May 16, 1997
priority date (Note) -
Expired
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Abstract
Capacitances in an impedance-matching box for an RF coil, in a plasma deposition system for depositing a film of sputtered target material on a substrate, can be varied during the deposition process so that the RF coil and substrate heating, and the film deposition, are more uniform due to 'time-averaging' of the RF voltage distributions along the RF coil.
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