Using scatterometry to measure resist thickness and control implant
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United States of America Patent
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Jun 17, 2003
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app pub date -
Jul 16, 2002
filing date -
Jan 16, 2002
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Abstract
The present invention provides systems and methods wherein scatterometry is used to control an implant processes, such as an angled implant process. According to the invention, data relating to resist dimensions is obtained by scatterometry prior to an the implant process. The data is used to determine whether a resist is suitable for an implant process and/or determine an appropriate condition, such as an angle of implant or implantation dose, for an implant process.
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