Fabrication method of an electronic component
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United States of America Patent
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Jun 17, 2003
Grant Date -
N/A
app pub date -
May 17, 2000
filing date -
May 18, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
An object of the present invention is to present a fabrication method for electronic components that allows further reduction in the size of electronic components by making the semiconductor substrate thinner, and at the same time allows operation as an electronic circuit with no problems, and further, has a durability sufficient to endure even use in a mobile telephone. In order to attain this object, the present invention has a first application process (process S12) in which encapsulating resin is applied to the surface of the substrate on which the posts are formed, a back surface grinding process (process S18) in which the back surface of said substrate is ground, a second application process (process S20) in which an encapsulating resin is applied to the back surface of said substrate after being ground, and a separation process (process S26) in which said substrate is cut along with said encapsulating resin and at the same time individual electronic components are separated.
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