Method for making a flexible circuit interposer having high-aspect ratio conductors
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United States of America Patent
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Jun 17, 2003
Grant Date -
Apr 25, 2002
app pub date -
Nov 30, 2000
filing date -
Mar 14, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A low-modulus-of-elasticity flexible adhesive interposer substrate has high aspect ratio via conductors to which an electronic device, such as a semiconductor chip or die or other component, is attached, e.g., for a high density electronic package. A method for making the flexible adhesive interposer substrate includes etching a sheet of metal to form the high aspect ratio via conductors which are held in position by a sheet or layer of a molecularly flexible adhesive. The via conductors may be built up to even greater aspect ratio. Such flexible interposer may include high aspect ratio via conductors for a plurality of similar or different electronic devices.
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