Semiconductor device and method of manufacturing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 17, 2003
Grant Date -
N/A
app pub date -
Oct 11, 2000
filing date -
Mar 17, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
First pad electrodes for connection to leads and second pad electrodes for an internal interface, are provided over a main surface of a first LSI chip. Third pad electrodes of a second LSI chip and the second pad electrodes of the first LSI chip are respectively electrically connected to one another by wires. Circuits required as for a system LSI, which are not included in the first LSI chip, are placed over the second LSI chip, to implement a desired function used as for a system LSI by the two LSI chips. The system LSI is easily implemented by a semiconductor device wherein a plurality of LSI chips are sealed with a resin.
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