Wafer level burn-in and test methods
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United States of America Patent
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-
Jun 17, 2003
Grant Date -
N/A
app pub date -
Jul 14, 1999
filing date -
Jul 14, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A cartridge (10) includes a chuck plate (12) for receiving a wafer (74) and a probe plate (14) for establishing electrical contact with the wafer. In use, a mechanical connecting device (90) locks the chuck plate and the probe plate fixed relative to one another to maintain alignment of the wafer and the probe plate. Preferably, electrical contact with the wafer is established using a probe card (50) that is movably mounted to the probe plate by means of a plurality of leaf springs (52). The mechanical connecting device is preferably a kinematic coupling including a male connector (94) and first and second opposed jaws (122, 124). The cartridge can then be removed from the alignment device and placed in a burn-in or test chamber that does not itself require means for aligning the wafer or for providing a probing force.
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