Method for washing wafer and apparatus used therefor
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United States of America Patent
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-
Jun 24, 2003
Grant Date -
Nov 15, 2001
app pub date -
Dec 27, 2000
filing date -
Dec 28, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method including the consecutive steps of: dipping a wafer in a washing solution in a washing chamber; replacing the washing solution by a first chemical solution in the washing chamber receiving therein the wafer, the first chemical solution including at least one chemical; dipping the wafer in the first chemical solution after stopping the replacing; and replacing the first chemical solution by a second chemical solution including the at least one chemical and having a concentration lower than a concentration of said first chemical solution. The number of the particles remaining on the wafer is significantly reduced compared with a conventional method to improve the removing rate of the particles deposited onto the wafer.
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